Argon
Compressed argon gas and liquid argon in a variety of purities and in various modes of supply around the world thanks to our network of storage and transfill facilities.
Integrated Circuit Packaging, Assembly and Test
Leveraging our unique and innovative technologies that help you enhance competitiveness
The electronics packaging and assembly industry is constantly adjusting to satisfy the requirements of the newest generation of semiconductors. Smaller footprint device sizes, 2.5D and 3D TSV packaging are just some of the changes that have occurred.
With these changes come challenges to the manufacturing process, so how to use and control of nitrogen or hydrogen-based atmospheres is critical to achieve the best performance.
Air Products’ expertise, technologies and gas supply advantages can provide improved performance and up-time, while reducing defects and total cost of ownership for your integrated circuit board assembly and test processes.
Global leading gas supplier for IC Packaging, Assembly and Test
Our core capabilities of product, equipment, and service include:
- Various supply modes, including onsite generation, bulk supply and packaged gases
- Bulk gases including, nitrogen, oxygen, hydrogen, helium and argon
- Ultra high purity process gases and gas mixtures
- Design, manufacture and installation of all related equipment
- Excellent record of meeting on-time needs
- Industry leader in safety
- Technical expertise
- World-class customer service
A cost-effective method to reflow your bumped wafers
If you need to improve your productivity and lower your costs, then consider our fluxless Electron Attachment solution, which uses non-flammable hydrogen and nitrogen blends to replace traditional flux chemistries for wafer-level packaging.
Activated Hydrogen for Fluxless Reflow for Wafer Level Packaging
Proprietary, patented innovation for wafer level packaging applications, including wafer bump and copper pillar reflow
Gases
Air Products gases, typically provided in gaseous and liquid form, enable customers in a wide range of industries to improve their environmental performance, product quality, and productivity.
Helium
An inert gas for cryogenic, heat transfer, shielding, leak detection, analytical and lifting applications
Hydrogen
Valued for its reactive and protective properties, and used by many industries such as electronics, foods, glass, chemicals, refining and more can benefit from its unique properties to improve quality, optimize performance and reduce costs.
Nitrogen
Useful as a gas, for its inert properties, and as a liquid for cooling and freezing. Virtually any industry can benefit from its unique properties to improve yields, optimize performance and make operations safer.
Oxygen
In addition to its use as a respiratory gas for healthcare applications, its strong oxidizing properties benefit many industries by improving yields, optimizing performance, lowering costs and reducing carbon footprint compared to other fuels.
Atmosphere optimization services to improve your soldering processes
Looking to improve your process? Utilizing knowledge applied at our worldwide customer base, Air Products’ global team conducts on-site audits to evaluate your manufacturing process and address your concerns. The site audit can provide realistic process cost savings and improvements, including recommendations for improving uptime, achieving higher productivity, and lowering manufacturing costs, as well as process enhancements that can be achieved through optimized gas usage.
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Ask the Expert
"Recently I am experiencing oxidation of my copper lead frames post molding final cure. I do not want to subject my assemblies to a rigorous acid clean and increase my costs, are there any alternatives?
This is a common issue that integrated circuit assembly companies have experienced. Post mold final cure and bake out are accomplished in a batch process in an oven. Temperatures for this process can exceed 200 °C and in an air atmosphere, will lead to oxidation of the copper lead frames.
The best alternative that has been adopted is to use an inert atmosphere within the post mold curing oven. Most standard ovens for this process are not designed to use an inert atmosphere. There are several vendors that manufacture inert atmosphere ovens for this process. The ideal O₂ ppm level for this process is < 1000 ppm. At these O₂ ppm levels, one can achieve good final cure and eliminate the copper lead frames for oxidizing. The initial cost to replace the ovens may be slightly prohibitive, however your overall cost of ownership will be reduced, and the quality of the assembly will be enhanced, not to mention the elimination of potential environmental issues with copper oxide removal via acid etch and deionized water cleaning.
Air Products has a new offering, Intelligent Nitrogen Control System (INCS), that can monitor the O₂ ppm levels in the curing oven and maintain a consistent O₂ ppm level while controlling the nitrogen gas consumed. Ask Air Products to evaluate your processes and how we can assist you in converting to an inert atmosphere post mold curing process.